الفهرس 
CHAPTER IOnly 14 pages are availabe for public view
 |  | from | 174 |  |  |
| | | from | 174 | | |
Abstract
The present thesis is devoted to study:
1)Thermal analysis and microstructure evolutions of both the plain solder Sn- 5wt% Zn and Sn- 5wt% Zn - 0.5 wt% nano-sized Al2O3 composite solder.
2)Tensile creep characteristics of the two solder alloys. The experimental results were investigated under different levels of stress/load ( = 10, 15, 20 and 25MPa) and temperature (T= 333,343,353,363,373,383 and 393K).
3)Study the hardness of both plain and composite solder alloys for applied load 10,50 and 100 gm at different time 15,30 and 50 sec.
4)Identification of the ability of soldering to conduct electrical conductivity with/without applied deformation on specimens.