الفهرس 
CHAPTER IOnly 14 pages are availabe for public view
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Abstract
The present thesis is devoted to study:
1 )Thermal analysis and microstructure evolutions of both the plain solder Sn- 5wt% Sb – 1.5 wt% Ag (SSA515) and SSA515–0.3 wt% nano-sized ZnO composite solder.
2)The effect of strain rates (ε•) from 4.4×10−3 up to 0.13x10-3 s-1 and testing temperatures (T) in the range from298 to 373 K on stress-strain characteristics of SSA515 plain and SSA515 composite wire samples.
3)Indentation creep characteristics using Vickers microhardness tester of the two solder alloys. The experimental results were performed under different loads, 98.07, 245.2, 490.3, and 980.7mN).
4)The effect of aging temperature on the indentation creep characteristics of SSA515plain and SSA515 composite solders at different testing loads.