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Abstract
Our study concerned with electroless nickel plating from alkaline bath containing sodium hypophosphite as reducing agent and sodium citrate as complexing agent.
It can be possible to deposit nickel- phosphorus, nickel-cobalt-phosphorus, nickel-tungsten-phosphorus and nickel-cobalt-tungsten-phosphorus deposits at relatively low bath temperature (80˚C). The optimum composition and operating conditions for obtaining low temperature electroless nickel bath for Ni-P, Ni-Co-P, Ni-W-P, and Ni-Co-W-P deposits are shown in the following table.